PCB Capabilities
Rigid PCB
Our Production Program: up to 100 Layer Boards
Description
Production
Advanced
Max. Finish Board Size:

double sided, mm

570 x 1250
600 x 1320

multilayer, mm

482 x 610
610 x 1100

rigid-flex,mm

407 x 508
457 x 711

flex, mm

400 x 600
250 x 2000

Min. Finish board Size, mm

5 x 5
2 x 2

Max. Board Thickness, mm

6,6
12

Min. Board Thickness, mm

0,17
0,125

Layer Count, layers

36
100

Min.Trace/Space, mm

0,05/0,05
0,025/0,025

Min. Copper Thickness, mm

0,012
0,007

Max. Copper Thickness, mm

0,21
0,35

Min. Core Thickness, mm

0,05
0,038

Line/ pad to drill hole, mm

0,125
0,100

Line/ pad to board edge, mm

0,20
0,15

Line Tolerance, %

+/-10
+/-6

Min. Drill Size, mm

0,15
0,125

Min. Hole to Hole Pitch, mm

0,35
0,25

Min gap from PTH to track inner layers, mm

0,125
0,10

Min. PTH edge to PTH edge space, mm

0,15
0,10

Min. drilled blind via diameter (as drilled), mm

0,2
0,15

Min.  space via edge to via edge (as drilled), mm

0,20
0,15

Mechanical depth tolerance, mm

0,10
0,05

Min. / Max., mm

0,064/0,15
0,04/0,12

Min. laser VIA pad, mm

0,18
0,15

Min. space from VIA edge to VIA dege, mm

0,2
0,15

True position Tolerance, mm

±0,025
±0,025

Max. Aspect Ratio

30
35

Max. Cu Thickness in Through hole, mm

38
70

Plated hole size tolerance, mm

±0,05
±0,038

NPTH hole tolerance, mm

±0,05
±0,038

Min. Via in pad Fill hole size, mm

0,15
0,10

Min.Trace/Space, mm

0,063/0,063
0,05/0,05

Min. pad over drill size, mm

0,15
0,10

Max. Copper thickness, mm

0,35
1

Line/ pad to board edge, mm

0,20
0,15

Line Tolerance, %

±15
±8

BGA Pitch, mm

0,255
0,175

Min. BGA pad/space, mm

0,18/0,075
0,125/0,05

Solder Mask Thickness, (min. / max), µm

10 (min)
50 (max)

Solder dam width, mm

0,10
0,075

Solder Mask registration tolerance, mm

0,038
0,025

Copper foil – Finish

1,3-65
1,3-65

HASL, um

1,3-65
1,3-65

HASL+Selective Hard gold

Yes
Yes

OSP, um

0,2-0,5
0,2-0,5

Selective ENIG+OSP

Yes
Yes

ENIG(Nickel/Gold), um

2 - 5/0,05-0,25
2 - 5/0,05-0,25

Immersion Silver, um

0,15-0,5
0,15-0,5

Hard Gold for Tab, um

0,5 – 2,0
4

Immersion Tin, um

0,75 – 1,50
0,75 – 1,50

ENEPIG (Ni/Pd/Au), um

3/1/0,025 min.
4/2/0,5 min.

Soft Gold (Nickel/ Gold), um

0,5 - 2
4

Min. Space to SMD pad, µm

15
10

Min. Stroke Width, µm

15
10

Min. Space to Copper pad, µm

15
10

Max. Test Points, pcs.

20.000
30.000

Smallest SMT Pitch, mm

0,45
0,30

Smallest BGA Pitch, mm

0,30
0,15

Min. rout to copper space, mm

0,20
0,10

Rout tolerance, mm

±0,10
±0,075

Conductor to center line, mm

0,38
0,3

X&Y Position Tolerance, mm

±0,10
±0,10

Score Anger

30º/45º
30º/45º

Score Web, mm

0,25
0,2

Punching tolerance, mm

±0,05
±0,05

Bevel anger

20°-70°
20°-70°

Bevel dimensional Tolerance, mm

±0,25
±0,25

Impedance control tolerance

±10%
±5%

Test coupon, impedance report

Yes
Yes

IPC class IPC-A-600J

2, 3, 3A
2, 3, 3A