Teflon 3 layer PCB with slots
PCB capabilities
Rigid, rigid-flexible and HDI PCB production
Special technologies
Quick turn and mass production PCB capabilities
Description
Regular
Advanced
(Contact to our engineers if you want to use "Advanced" column in mass production)
Max finish board size:
  • double sided, mm
570 x 1250
600 x 1320
  • multilayer, mm
482 x 610
510 x 685
  • rigid-flex,mm
407 x 508
457 x 711
  • flexible, mm
400 x 600
250 x 2000

Min finish board size, mm

5.0 x 5.0
2.0 x 2.0

Max board thickness, mm

6.6
12.0

Min board thickness, mm

0.17
0.125

Max layer count

36
64

Min core thickness, mm

0.050
0.038

HDI type I…IV (IPC-2226A)

1+n+1 ... 4+n+4
5+n+5 ... 9+n+9; Stacked µVia; Any layer µVia
Inner layers:

Min trace/space, mm

0.05/0.05
0.025/0.025

Min copper foil thickness, mm

0.012
0.007

Max copper foil thickness, mm

0.210
0.350

Copper trace/pad to drill hole, mm

0.125
0.100

Copper trace/pad to board edge, mm

0.20
0.15

Copper trace width tolerance, %

±10
±6
Outer layers:

Min trace/space, mm

0.063/0.063
0.050/0.050

Min pad over drill size, mm

0.15
0.10

Max copper foil thickness, mm

0.210
0.350

Copper trace/pad to board edge, mm

0.20
0.15

Copper trace width tolerance, %

±15
±8

Min BGA pitch, mm

0.255
0.175

Min BGA pad/space, mm

0.180/0.075
0.125/0.050
Drilling:

Min mechanical drill size, mm

0.15
0.125

Min gap from PTH wall to trace, mm

0.125
0.10

Min PTH edge to PTH edge spacing, mm

0.15
0.10

Min drilled blind via diameter (as drilled), mm

0.20
0.15

Min via edge to via edge spacing (as drilled), mm

0.20
0.15

Mechanical hole depth tolerance, mm

±0.10
±0.05
Laser µVia:

Min / Max laser µVia diameter, mm

0.064/0.12
0.05/0.12

Min laser µVia pad, mm

0.18
0.15

Min spacing from µVia edge to µVia edge, mm

0.20
0.15

Laser µVia depth tolerance, mm

±0.025
±0.025
Holes plating:

Max PTH aspect ratio

30
35

Max Cu thickness in through hole, mm

38
70

Plated hole (PTH) size tolerance, mm

±0.1
±0.05

Non-plated hole (NPTH) size tolerance, mm

±0.05
±0.038

Min via-in-pad fill hole size, mm

0.15
0.10
Solder Mask (LPI):

Solder mask thickness (min / max), µm

10 / 50
10 / 50

Min solder mask dam between pads, mm

0.10
0.075

Solder mask registration tolerance, mm

±0.038
±0.025

Solder mask colors (matt, glossy)

green, white, grey, red, blue, yellow, violet
black
Surface finish:

HASL (leaded or lead free), µm

1.3-65
1.3-65

HASL + Selective hard gold

Yes
Yes

OSP, µm

0.2-0.5
0.2-0.5

Selective ENIG + OSP

Yes
Yes

ENIG (Ni/Au), µm (IPC-4552B)

2.0-5.0 / 0.04-0.10
2.0-5.0 / 0.04-0.10

Immersion silver, µm (IPC-4553A)

0.12-0.40
0.12-0.40

Hard gold for tab, µm

0.5 – 2.0
4.0

Immersion tin, µm (IPC-4554 01)

1.0 – 1.5
1.0 – 1.5

ENEPIG (Ni/Pd/Au), µm (IPC-4556 01)

3-6 / 0.05-0.3 / 0.03-0.07
3-6 / 0.05-0.3 / 0.03-0.07

Soft Gold (Ni/Au), µm

3-5 / 0.5 - 2
3-5 / max 4
Silkscreen legend:

Silkscreen colors

white, black, yellow
-

Min silk space to SMD pad, µm

15
10

Min silk stroke width, µm

15
10

Min silk space to copper pad, µm

15
10
Electrical test:

Max number of test points, pcs

20 000
30 000

Smallest SMT pitch for E-test, mm

0.45
0.30

Smallest BGA pitch for E-test, mm

0.3
0.15
NC routing (milling):

Min NC route to copper spacing, mm

0.20
0.10

Routing tolerance, mm

±0.10
±0.075
V-score (V-cut):

Conductor to V-cut center line, mm

0.38
0.3

V-cut X&Y position tolerance, mm

±0.10
±0.10

V-score angle

60º
30º/45º

Min score web (rest of material), mm

0.25
0.2
Punch for mass production:

Punching tolerance, mm

±0.05
±0.05
Bevelling for edge connectors:

Bevel angle

20°-70°
20°-70°

Bevel dimensional tolerance, mm

±0.15
±0.10
Impedance control:

Impedance control tolerance

±10%
±5%

Test coupon, impedance report

Yes
Yes

IPC class

2, 3 (IPC-A-600J)
3A (IPC-A-600J)