PCB capabilities

Technologies PCB capabilities

PCB capabilities

Rigid, rigid-flexible and HDI PCB production

Special technologies	press-fit holes in PCB hybrid RF multilayer PCB via-in-pad back drilling in PCB high-frequency PCBs tight tolerance impedance controlled PCBs rigid-flexible PCB, including bookbinder copper coin PCB

Quick turn and mass production PCB capabilities

Description

Regular

Advanced

(Contact to our engineers if you want to use "Advanced" column in mass production)

Max finish board size:

double sided, mm

570 x 1250

600 x 1320

multilayer, mm

482 x 610

510 x 685

rigid-flex,mm

407 x 508

457 x 711

flexible, mm

400 x 600

250 x 2000

Min finish board size, mm

5.0 x 5.0

2.0 x 2.0

Max board thickness, mm

6.6

12.0

Min board thickness, mm

0.17

0.125

Max layer count

Min core thickness, mm

0.050

0.038

HDI type I…IV (IPC-2226A)

1+n+1 ... 4+n+4

5+n+5 ... 9+n+9; Stacked µVia; Any layer µVia

Inner layers:

Min trace/space, mm

0.05/0.05

0.025/0.025

Min copper foil thickness, mm

0.012

0.007

Max copper foil thickness, mm

0.210

0.350

Copper trace/pad to drill hole, mm

0.125

0.100

Copper trace/pad to board edge, mm

0.20

0.15

Copper trace width tolerance, %

±10

±6

Outer layers:

Min trace/space, mm

0.063/0.063

0.050/0.050

Min pad over drill size, mm

0.15

0.10

Max copper foil thickness, mm

0.210

0.350

Copper trace/pad to board edge, mm

0.20

0.15

Copper trace width tolerance, %

±15

±8

Min BGA pitch, mm

0.255

0.175

Min BGA pad/space, mm

0.180/0.075

0.125/0.050

Drilling:

Min mechanical drill size, mm

0.15

0.125

Min gap from PTH wall to trace, mm

0.125

0.10

Min PTH edge to PTH edge spacing, mm

0.15

0.10

Min drilled blind via diameter (as drilled), mm

0.20

0.15

Min via edge to via edge spacing (as drilled), mm

0.20

0.15

Mechanical hole depth tolerance, mm

±0.10

±0.05

Laser µVia:

Min / Max laser µVia diameter, mm

0.064/0.12

0.05/0.12

Min laser µVia pad, mm

0.18

0.15

Min spacing from µVia edge to µVia edge, mm

0.20

0.15

Laser µVia depth tolerance, mm

±0.025

Holes plating:

Max PTH aspect ratio

Max Cu thickness in through hole, mm

Plated hole (PTH) size tolerance, mm

±0.1

±0.05

Non-plated hole (NPTH) size tolerance, mm

±0.05

±0.038

Min via-in-pad fill hole size, mm

0.15

0.10

Solder Mask (LPI):

Solder mask thickness (min / max), µm

10 / 50

Min solder mask dam between pads, mm

0.10

0.075

Solder mask registration tolerance, mm

±0.038

±0.025

Solder mask colors (matt, glossy)

green, white, grey, red, blue, yellow, violet

black

Surface finish:

HASL (leaded or lead free), µm

1.3-65

HASL + Selective hard gold

Yes

OSP, µm

0.2-0.5

Selective ENIG + OSP

Yes

ENIG (Ni/Au), µm (IPC-4552B)

2.0-5.0 / 0.04-0.10

Immersion silver, µm (IPC-4553A)

0.12-0.40

Hard gold for tab, µm

0.5 – 2.0

4.0

Immersion tin, µm (IPC-4554 01)

1.0 – 1.5

ENEPIG (Ni/Pd/Au), µm (IPC-4556 01)

3-6 / 0.05-0.3 / 0.03-0.07

Soft Gold (Ni/Au), µm

3-5 / 0.5 - 2

3-5 / max 4

Silkscreen legend:

Silkscreen colors

white, black, yellow

Min silk space to SMD pad, µm

Min silk stroke width, µm

Min silk space to copper pad, µm

Electrical test:

Max number of test points, pcs

20 000

30 000

Smallest SMT pitch for E-test, mm

0.45

0.30

Smallest BGA pitch for E-test, mm

0.3

0.15

NC routing (milling):

Min NC route to copper spacing, mm

0.20

0.10

Routing tolerance, mm

±0.10

±0.075

V-score (V-cut):

Conductor to V-cut center line, mm

0.38

0.3

V-cut X&Y position tolerance, mm

±0.10

V-score angle

60º

30º/45º

Min score web (rest of material), mm

0.25

0.2

Punch for mass production:

Punching tolerance, mm

±0.05

Bevelling for edge connectors:

Bevel angle

20°-70°

Bevel dimensional tolerance, mm

±0.15

±0.10

Impedance control:

Impedance control tolerance

±10%

±5%

Test coupon, impedance report

Yes

IPC class

2, 3 (IPC-A-600K)

3A (IPC-A-600K)